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Media Alert: Rambus Presenting Sessions on Emerging Memory and Compute Architectures for the Evolving Data Center

August 9, 2021

SAN JOSE, Calif. – August 9, 2021 –

What:                                  

DesignCon 2021



Who:                                    

Rambus Inc. (Nasdaq: RMBS), a premier chip and silicon IP provider



Where:                               

Online and at the San Jose McEnery Convention Center


150 West San Carlos Street


San Jose, CA 95113



When:                                 

August 17, 2021. The first session begins at 9:00 a.m. PT

At DesignCon, technology experts from Rambus and ecosystem partner PLDA will be conducting a series of presentations on Tuesday, August 17. These will cover the selection and implementation of IP solutions for the data center, 5G/edge and IoT devices, including emerging technologies like HBM2E, GDDR6, PCIe 6.0 and CXL 2.0 interfaces.

Hear Steven Woo, fellow and distinguished inventor at Rambus, discuss, "Emerging Compute Architectures for the Evolving Data Center," exploring technologies that will shape the future evolution of the data center. Join Frank Ferro, senior director of product management at Rambus, address key design and implementations of HBM2E and GDDR6 memory subsystems in the "Selecting the Right High-Performance Memory Solution" training – or drop in on his later presentation diving into "What's Next for High-Bandwidth Memory?"

Trupti Gowda, field applications engineer at PLDA, will be discussing the latest developments in serial interconnect solutions in "Introduction to PCI Express 6.0 Interface Solutions," and later in the day during "Introduction to CXL 2.0 Interconnect Solutions." And attend a discussion of "3D Packaging Solutions," by Ming Li, technical director at Rambus, reviewing design considerations and methodologies for implementing a 2.5D/3D architecture for an HBM2/HBM2E memory solution.

To find out more about the Rambus training sessions being presented at DesignCon, visit https://www.rambus.com/designcon/. For more details on our latest Rambus high-speed memory and SerDes PHY solutions, as well as security IP solutions, visit rambus.com.

Follow Rambus:
Company website: rambus.com 
Rambus blog: rambus.com/blog 
Twitter: @rambusinc 
LinkedIn: www.linkedin.com/company/rambus 
Facebook: www.facebook.com/RambusInc 

About Rambus Inc.
Rambus is a provider of industry-leading chips and silicon IP making data faster and safer. With over 30 years of advanced semiconductor experience, we are a pioneer in high-performance memory subsystems that solve the bottleneck between memory and processing for data-intensive systems. Whether in the cloud, at the edge or in your hand, real-time and immersive applications depend on data throughput and integrity. Rambus products and innovations deliver the increased bandwidth, capacity and security required to meet the world's data needs and drive ever-greater end-user experiences. For more information, visit rambus.com.

Press Contact:
Cori Pasinetti
Rambus Corporate Communications
t: (650) 309-6226
cpasinetti@rambus.com 

/PRNewswire -- Aug. 9, 2021/

SOURCE Rambus Inc.