Suite of silicon-proven PHYs on 14nm LPP process technology maximize
performance and flexibility
SUNNYVALE, Calif.--(BUSINESS WIRE)--
Rambus
Inc. (NASDAQ: RMBS), a leading provider of semiconductor and IP
products, today announced the availability of a suite of silicon-proven,
high-speed SerDes solutions including 16G
MPSL (multi-protocol serial link), 30G
C2C (chip-to-chip) and 30G
VSR (very short reach) PHYs developed for GLOBALFOUNDRIES
high-performance FX-14™ ASIC platform. Built on the GLOBALFOUNDRIES’
14nm FinFET (14LPP) process technology, the Rambus SerDes PHYs are
optimized for power and area at peak bandwidth, generating Ethernet
speeds up to 100Gb and beyond for high-speed wireline, wireless, 5G
network infrastructure, high-performance servers, storage, connectivity
and compute applications.
“Data traffic and bandwidth demands have exploded, driving the
insatiable need for highly optimized, high-performance semiconductor
solutions,” said Luc Seraphin, senior vice president and general manager
of the Rambus Memory and Interfaces Division. “Through our collaboration
with GLOBALFOUNDRIES, Rambus is delivering robust high-speed interface
IP that enables innovative chips and systems designed specifically for
the Data Center and Communications markets and helping GLOBALFOUNDRIES
deliver value to its customers through tested solutions.”
“Next-generation systems for cloud and communications must deliver more
performance and handle more complexity than ever before,” said Kevin
O’Buckley, vice president of product development at GLOBALFOUNDRIES.
“Working together with Rambus enables us to provide ASIC solutions to
our customers with a range of high-speed SerDes interfaces that have
been optimized for power and area at peak bandwidth while maintaining
complete compatibility with industry standards.”
The Rambus SerDes PHYs include a Physical Media Attachment (PMA) hard
macro and Physical Coding Sub-layer with Built-in Self-Test (PCS-BIST)
soft macro. The PHYs can also be configured to multiple channel widths
and packaging options, which simplifies integration and maximizes design
flexibility.
For additional information on Rambus SerDes Interface Solutions, please
visit rambus.com/serdes.
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About Rambus Memory and Interfaces Division
The Rambus Memory and Interfaces Division develops products and services
that solve the power, performance, and capacity challenges of the
communications and data center computing markets. Rambus enhanced
standards-compatible and custom memory and serial link solutions include
chips, architectures, memory and SerDes interfaces, IP validation tools,
and system and IC design services. Developed through our system-aware
design methodology, Rambus products deliver improved time-to-market and
first-time-right quality.
About Rambus Inc.
Rambus creates innovative hardware and software technologies, driving
advancements from the data center to the mobile edge. Our chips,
customizable IP cores, architecture licenses, tools, software, services,
training and innovations improve the competitive advantage of our
customers. We collaborate with the industry, partnering with leading
ASIC and SoC designers, foundries, IP developers, EDA companies and
validation labs. Our products are integrated into tens of billions of
devices and systems, powering and securing diverse applications,
including Big Data, Internet of Things (IoT), mobile payments, and smart
ticketing. At Rambus, we are makers of better. For more information,
visit rambus.com.
Source: Rambus Inc.
View source version on businesswire.com: http://www.businesswire.com/news/home/20171012005488/en/
Source: Rambus Inc.