Comprehensive IP solution enables high performance for networking and
data center applications
SUNNYVALE, Calif.--(BUSINESS WIRE)--
Rambus
Inc. (NASDAQ:RMBS) today announced the
availability of a 28Gbps multi-modal serial link PHY on Samsung's
leading-edge 14nm Low Power Plus (LPP) process. The R+ 28G Serial Link
PHY is a 100 Gigabit Ethernet solution that is optimized for power and
area efficiency in long-reach channels. It enhances the Rambus suite of
high-speed memory and serial link interfaces.
"The increasing demand for more data at increasing speeds continues to
drive the bandwidth requirements in enterprise applications," said Luc
Seraphin, senior vice president and general manager of the Rambus Memory
and Interfaces division. "We are pleased Samsung has selected us to work
in their advanced 14nm LPP process, enabling our solutions to achieve
the tremendous speeds and power efficiencies required by today's
high-performance systems."
The Rambus R+ 28G Multi-protocol Serial Links PHY delivers
enterprise-class performance across the challenging signaling
environments typical of networking and server systems with features
including:
-
High-performance and multi-protocol compatibility with support for
data rates from 1.25Gbps to 28.1Gbps across copper and backplane
channels with up to 30dB loss in a wide range of industry-standard
interconnect protocols.
-
Application-specific optimization enabled by an efficient and scalable
architecture with adaptive and programmable receive equalization, and
support for transmit FIR adaptation.
-
Ease-of-integration and bring-up featuring built-in-self-test (BIST)
with PRBS generator and checker, in-situ real-time monitoring and
support for LabStation™ Validation Platform.
Rambus' R+ industry-standard interface solutions are high-quality,
complete PHY solutions designed with a system-oriented approach,
maximizing flexibility in today's most challenging system environments.
For additional information, please visit rambus.com/seriallinks.
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About Rambus Memory and Interfaces Division (MID)
The Rambus Memory and Interfaces Division develops products and services
that solve the power, performance, and capacity challenges of the
mobile, connected device, and cloud computing markets. Rambus enhanced
standards-compatible and custom memory and serial link solutions include
chips, architectures, memory and chip-to-chip interfaces, DRAM, IP
validation tools, and system and IC design services. Developed through
our system-aware design methodology, Rambus products deliver improved
time-to-market and first-time-right quality.
About Rambus Inc.
Rambus creates cutting-edge semiconductor and IP products, spanning
memory and interfaces to security, smart sensors and lighting. Our
chips, customizable IP cores, architecture licenses, tools, services,
training and innovations improve the competitive advantage of our
customers. We collaborate with the industry, partnering with leading
ASIC and SoC designers, foundries, IP developers, EDA companies and
validation labs. Our products are integrated into tens of billions of
devices and systems, powering and securing diverse applications,
including Big Data, Internet of Things (IoT), mobile, consumer and media
platforms. At Rambus, we are makers of better. For more information,
visit rambus.com.
RMBSTN
View source version on businesswire.com: http://www.businesswire.com/news/home/20160119006684/en/
Racepoint Global
Hilary Costa, 415-694-6705
hcosta@racepointglobal.com
Source: Rambus Inc.
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