Architecture enhances power and performance in military, aerospace
and commercial applications
SUNNYVALE, Calif. & NAPERVILLE, Ill.--(BUSINESS WIRE)--
Rambus Inc. (NASDAQ:RMBS) and Tezzaron Semiconductor today announced
that they have signed an agreement to incorporate Rambus oxide-resistive
memory (ReRAM) technology in forthcoming Tezzaron devices. This
architecture license gives Tezzaron access to system IP, specifications
and validation suites to design differentiated chips using ReRAM, which
is ideally suited to improve the power and performance requirements in
military, aerospace, and commercial memory applications.
"Rambus is a great company to work with and their ReRAM technology is a
game-changer," said Bob Patti, chief technology officer at Tezzaron. "By
implementing ReRAM in our unique 3D architecture, we can revolutionize
high-performance computing with better endurance and superior power
efficiency."
"At Rambus we are continually developing comprehensive memory solutions
that take into account the evolving needs of an increasingly diverse
market," said Gary Bronner, vice president of Rambus Labs. "ReRAM fills
the gap between what DRAM and Flash can provide while being highly
reliable and high speed. Collaboration with Tezzaron takes full
advantage of this new technology by differentiating the memory
architecture for numerous use cases across the embedded landscape."
Tezzaron plans to build ReRAM into storage-class 3D memory devices for
military, aerospace and commercial applications. Tezzaron also plans to
implement ReRAM in an assortment of SoCs, FPGAs and processors to
exploit the extensive split-fab production experience of Tezzaron's
fabrication subsidiary, Novati Technologies. Using ReRAM, Novati can add
hundreds of megabytes of storage to a logic device manufactured in a
standard commercial fab.
In addition to military and aerospace applications, ReRAM technology can
be utilized in a variety of embedded storage memory devices where low
power, design integration, cost and performance are all important
factors. Among these, the development of storage memory in connected
devices is fast becoming critical.
The first in Tezzaron's family of ReRAM devices is currently in design
and is scheduled for production in 2016.
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About Rambus Inc.
Rambus brings invention to market. Our customizable IP cores,
architecture licenses, tools, services, and training improve the
competitive advantage of our customer's products while accelerating
their time-to-market. Rambus products and innovations capture, secure
and move data. For more information, visit rambus.com.
RMBSTN
About Tezzaron Semiconductor
Tezzaron is a full service turn-key supplier of 3D and 2.5D memory,
memory subsystems and memory-intensive SoCs. Tezzaron specializes in 3D
wafer and die stacking, TSV processes and wide-ranging collaborations,
creating commercial parts as well as custom devices for prototyping and
production. For more information, visit www.Tezzaron.com.
About Novati Technologies
Novati Technologies, a wholly owned subsidiary of Tezzaron, is the
premier innovation partner for accelerating nanotechnology development
and commercialization. Novati's proven advanced technology and secure IP
infrastructure, combined with its recognized Technology Development
Process, supports companies developing MEMS, microfluidics, novel
transistors, photovoltaics and other nanotechnologies for the
semiconductor, life sciences and aerospace and defense markets. For more
information, visit www.Novati-Tech.com.
MSLGROUP for Rambus
Sam Katzen, 415-512-0770
rambus@mslgroup.com
Source: Rambus Inc.
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