SAN FRANCISCO, Sep 13, 2010 (BUSINESS WIRE) -- Rambus Inc. (NASDAQ: RMBS):
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Who:
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Rambus Inc. (NASDAQ: RMBS)
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Where:
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Intel Developer Forum 2010
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Booth #207
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Moscone Center West
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San Francisco, California
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When:
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September 13-15, 2010
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Join Rambus, one of the world's premier technology licensing companies,
at the Intel Developer Forum 2010 to learn more about next-generation
memory solutions for mobile and graphics applications. In addition,
Rambus will exhibit demos of its award-winning innovations including its
XDR(TM) memory product showcase.
Rambus Presentation
Monday, September 13, 4:25 p.m. PT
"Meeting the Challenges for Next-Generation Mobile and Graphics Memory"
Presented by Dr. Judy Chen, strategic development director and Dr. Steve
Woo, technical director at Rambus
Moscone Center West, Room 2011
During the session, Drs. Chen and Woo will discuss how next-generation
mobile and graphics systems share the need for higher-performance,
power-efficient memory in order to deliver compelling consumer
experiences. They will outline techniques to help address the challenges
of managing signal and power integrity, reducing component and board
costs, and delivering multi-modal functionality.
Rambus Demos and Displays
The product showcase will exhibit high-performance, power-efficient, and
innovative designs in some of today's most compelling electronics
products. Rambus will demonstrate its latest technology developments in
the areas of mobile, gaming and graphics, and computing main memory
solutions.
Mobile XDR(TM) Memory Architecture
The fastest and most power-efficient memory for mobile applications.
Capable of achieving data rates of 3.2 to 4.3 gigabits per second (Gbps)
at an unprecedented power efficiency of 2.2 milliwatts per gigabit per
second (mW/Gbps), Mobile XDR memory is ideal for next-generation
smartphones, netbooks, mobile gaming and mobile multimedia products.
DDR3 PHY Development Package
This high-performance, low-cost DDR3 memory controller interface
solution is tailored for consumer electronics. The solutions is the
first to demonstrate operation in working silicon at a data rate of 1866
megatransfers per second (MT/s) in a low-cost wire bond package.
XDR 2 Memory Architecture
Designed for scalability, power efficiency and manufacturability, the
XDR 2 memory architecture is a complete memory solution ideally suited
for high-performance gaming, graphics and multi-core computing
applications.
DDR3 Module Threading Demonstration
Driven by multi-core computing, virtualization and processor integration
trends, the industry needs a next-generation main memory solution
capable of achieving data rates of up to 3200MT/s in the same, or lower
power envelope as the current DDR3 1600MT/s memory solution. This system
demo will show how the innovation of Module Threading can be used to
boost memory throughput at reduced power.
About Rambus Inc.
Rambus is one of the world's premier technology licensing companies.
Founded in 1990, the Company specializes in the invention and design of
architectures focused on enhancing the end-user experience of electronic
systems. Rambus' patented innovations and breakthrough technologies help
industry-leading companies bring superior products to market. Rambus
licenses both its world-class patent portfolio, as well as its family of
leadership and industry-standard solutions. Headquartered in Los Altos,
California, Rambus has regional offices in North Carolina, Ohio, India,
Germany, Japan, and Taiwan. Additional information is available at www.rambus.com.
RMBSTN
SOURCE: Rambus Inc.
Rambus Inc.
Linda Ashmore, 650-947-5411
lashmore@rambus.com
or
The Hoffman Agency for Rambus
Lori Shen, 408-975-3053
lshen@hoffman.com
Copyright Business Wire 2010