BEIJING, Apr 12, 2010 (BUSINESS WIRE) -- Join Rambus
Inc. (NASDAQ: RMBS), one of the world's premier technology licensing
companies, at the Intel Developer Forum (IDF) in Beijing. Rambus Fellow
Craig Hampel will discuss memory architectures for multi-core computing
during a talk on Tuesday, April 13 at 1:00pm in Room 307A at CNCC. In
addition, Rambus will showcase live demos of its Mobile XDR(TM) memory
architecture and new lighting technology, including MicroLens(TM) optical
design technology.
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Who:
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Rambus Inc. (NASDAQ: RMBS)
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Where:
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Intel Developer Forum
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China National Convention Center (CNCC)
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No. 7 Tianchen East Rd, Chaoyang District
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Beijing, China
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Booth: #G3
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When:
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April 13-14, 2010
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Mobile XDR Memory Architecture
Rambus will demonstrate its Mobile XDR memory architecture, the world's
fastest and most power-efficient memory for mobile applications. Capable
of achieving data rates of 3.2 to 4.3 Gigabits per second (Gbps) per pin
at an unprecedented power efficiency of 2.2 milliwatts per Gigabit per
second (mW/Gbps), Mobile XDR memory is ideal for the low-power and
high-performance requirements of next-generation smartphones, netbooks,
and mobile gaming and multimedia products.
Lighting Technology
Rambus' MicroLens technology allows designers to achieve efficient
uniform brightness in edge-lit LED backlights in a very economical
manner. In large format displays such as HDTVs, Rambus' technology can
enable backlights that use fewer or less expensive LEDs than required
for conventional edge-lit implementations.
Threaded Module Prototype
Rambus will also showcase its static prototype Threaded Module
co-developed in partnership with Kingston Technology. This module is
implemented using eight industry-standard DDR3 1333 DRAM devices,
showing techniques that can increase data throughput by up to 50% and
reduce power consumption by 20% when compared to conventional modules.
About Rambus Inc.
Rambus is one of the world's premier technology licensing companies.
Founded in 1990, the Company specializes in the invention and design of
architectures focused on enhancing the end-user experience of computing,
communications and consumer electronics applications. Rambus' patented
innovations and breakthrough technologies in the area of high-speed
memory architectures and complementary technologies have helped
industry-leading chip and system companies bring superior products to
market. Rambus' technology and renowned integration expertise solve some
of the most complex chip and system-level interface challenges. Rambus
licenses both its world-class patent portfolio as well as its family of
leadership and industry-standard interface products. Headquartered in
Los Altos, California, Rambus has regional offices in North Carolina,
Ohio, India, Germany, Japan, and Taiwan. Additional information is
available at www.rambus.com.
Rambus and the Rambus logo are registered trademarks of Rambus Inc.
All other trade names are the service marks, trademarks, or registered
trademarks of their respective owners.
RMBSTN
SOURCE: Rambus Inc.
Rambus Inc.
Linda Ashmore, 650-947-5411
lashmore@rambus.com
or
The Hoffman Agency for Rambus
Lori Shen, 408-975-3053
lshen@hoffman.com
Copyright Business Wire 2010